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回首頁 > 產品介紹 > STAR 鋁基板 |
1. Thermal Conductivity (熱導係數) :3 w/mk(℃)
2.Peel strength (銅皮與膠布之附合力): Cu/1oz 2.5Kg/cm
3. Surface resistivity (絕緣膠布): 5*10^6 MΩ
4. Breakdown voltage(銅皮與鋁基層之相對擊潰電壓):3 Kv(500 V/sec )
5. Solder heat resistance (焊接耐熱溫度): 288℃-- 300 sec
6. Glass transition temp (液態點): 130℃＋－5℃
7. After pressed thickness (製成膠布壓合後成型固化厚度): 0.1mm |
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